High-speed mass production ball mount SBM371
Solder balls can be rapidly mounted in bulk on BGA substrates, connectors, and more. There is also a track record of mounting solder balls on items other than substrates.
This machine is a system that performs high-precision positioning using image processing to mount solder balls on PLP/BGA/CSP substrates. It supports not only bulk mounting by frame units but also simultaneous mounting of multiple individual substrates through optional features. It is also possible to propose a consistent line that includes the connection of inspection machines and peripheral devices such as mounters, reflow ovens, and cleaning machines. There is also a high demand for solder ball mounting on substrates with irregular shapes, such as connectors, and we provide system proposals from development to mass production.
- 企業：澁谷工業 メカトロ統轄本部
- 価格：Other
